嵌入式芯片技术可靠性分析与实验方法设计

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI:10.1109/EMAP.2005.1598233

Xiuzhen Lu, Liu Chen, Z. Cheng, Johan Liu

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引用次数: 4

摘要

本文对液晶衬底上嵌入元件的可靠性和失效进行了分析。首先，制作了嵌入式技术的演示模块。然后进行热循环，找出最明显的失效点。采用三维有限元分析方法对其破坏模式进行了研究。为获得嵌入式芯片元件的最优结构，设计了实验方法。

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Reliability analysis of embedded chip technique with design of experiment methods

This paper presents reliability and failure analysis of embedded components on the liquid crystalline substrate. First, a demonstration module for embedded technology is fabricated. Then it is put into thermal cycling to find out the most obvious failure. 3D FEM analysis is employed to investigate the failure mode. A design of experiment method is conducted to obtain the optimal structure of embedded chip components.

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2005 International Symposium on Electronics Materials and Packaging

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