{"title":"高速链路中信号完整性的x参数技术","authors":"J. Schutt-Ainé, T. Comberiate","doi":"10.1109/EPTC.2013.6745719","DOIUrl":null,"url":null,"abstract":"X-parameters have been shown to have a wide array of applications in the modeling of nonlinear devices and systems. In this work we demonstrate that they can be combined with LIM and IBIS to produce robust models for high-speed links. In particular IBIS data generation from X parameters is demonstrated and its advantage over currently available methods is discussed.","PeriodicalId":210691,"journal":{"name":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"X-parameter techniques for signal integrity in high-speed links\",\"authors\":\"J. Schutt-Ainé, T. Comberiate\",\"doi\":\"10.1109/EPTC.2013.6745719\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"X-parameters have been shown to have a wide array of applications in the modeling of nonlinear devices and systems. In this work we demonstrate that they can be combined with LIM and IBIS to produce robust models for high-speed links. In particular IBIS data generation from X parameters is demonstrated and its advantage over currently available methods is discussed.\",\"PeriodicalId\":210691,\"journal\":{\"name\":\"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2013.6745719\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2013.6745719","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
X-parameter techniques for signal integrity in high-speed links
X-parameters have been shown to have a wide array of applications in the modeling of nonlinear devices and systems. In this work we demonstrate that they can be combined with LIM and IBIS to produce robust models for high-speed links. In particular IBIS data generation from X parameters is demonstrated and its advantage over currently available methods is discussed.