通过涂覆在薄片上的粘接膜，在芯片基片上制备均匀的抗蚀膜

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598390

Tomoya Onuki, Shigenori Saito, M. Sasaki

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引用次数: 0

摘要

提出了一种新型的固体光刻胶粘接方法，以改善芯片衬底的厚度均匀性。水溶性聚合物支撑抗蚀剂薄膜，并在图案化之前溶解。芯片区域可以使用到边缘。最大偏差为1.73 μm +/−1.2%。

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Uniform resist film on chip substrate prepared by bonding film coated on sheet

A new method of bonding the solid photoresist film is proposed for improving the thickness uniformity on the chip substrate. The water-soluble polymer supports the resist film and is dissolved before patterning. The chip area can be used up to the edge. The resist thickness demonstrated is 1.73 μm +/−1.2% in maximum deviation.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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