纳米压痕能帮助确定微电子材料的局部力学性能吗?最先进的评论

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396652

H. Albrecht, T. Hannach, A. Hase, A. Juritza, K. Műller, W. Muller

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引用次数: 6

摘要

利用纳米压痕技术研究了微电子结构中金属间相的力学性能。此外，我们将尝试回答纳米压痕是否可以用于量化金属间相的生长的问题，至少在焊料连接的界面上。分析了不同的试样和处理方法(如回流工艺和随后的时效)。这些实验结果为有限元模拟提供了参考价值。

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Can nanoindentation help to determine the local mechanical properties of microelectronic materials? a state-of-the-art review

We investigate the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Moreover, we shall try to answer the question as to whether nanoindentation can be used to quantify the growth of intermetallic phases, at least at the interface of a solder connection. Different specimens and treatments (such as reflow processes and subsequent aging) have been analyzed. The results of these experiments serve as reference values for FE-simulations which are also discussed.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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