探测对衬垫防潮性的影响:减小衬垫尺寸的挑战

2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS) Pub Date : 2019-03-01 DOI:10.1109/ICMTS.2019.8730990

Matthias Vidal-Dhô, Q. Hubert, P. Gonon, Philippe Delorme, J. Jacquot, Maxime Marchetti, L. Beauvisage, J. Moragues, Pascale Potard, P. Fornara, Jean-Philippe Escales, Pascal Sallagoity, O. Pizzuto, Delphine Maury, J. Mirabel

{"title":"探测对衬垫防潮性的影响:减小衬垫尺寸的挑战","authors":"Matthias Vidal-Dhô, Q. Hubert, P. Gonon, Philippe Delorme, J. Jacquot, Maxime Marchetti, L. Beauvisage, J. Moragues, Pascale Potard, P. Fornara, Jean-Philippe Escales, Pascal Sallagoity, O. Pizzuto, Delphine Maury, J. Mirabel","doi":"10.1109/ICMTS.2019.8730990","DOIUrl":null,"url":null,"abstract":"This paper underlines the damages induced by probing on narrow pads reliability of specifically designed test structures placed on dicing streets and indicates that probing during electrical test steps provokes detrimental cracks diving from the passivation through the BEOL layers providing a path for moisture ingress.","PeriodicalId":333915,"journal":{"name":"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Probing impact on pad moisture tightness: A challenge for pad size reduction\",\"authors\":\"Matthias Vidal-Dhô, Q. Hubert, P. Gonon, Philippe Delorme, J. Jacquot, Maxime Marchetti, L. Beauvisage, J. Moragues, Pascale Potard, P. Fornara, Jean-Philippe Escales, Pascal Sallagoity, O. Pizzuto, Delphine Maury, J. Mirabel\",\"doi\":\"10.1109/ICMTS.2019.8730990\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper underlines the damages induced by probing on narrow pads reliability of specifically designed test structures placed on dicing streets and indicates that probing during electrical test steps provokes detrimental cracks diving from the passivation through the BEOL layers providing a path for moisture ingress.\",\"PeriodicalId\":333915,\"journal\":{\"name\":\"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.2019.8730990\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2019.8730990","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文强调了放置在碎块街道上的专门设计的测试结构在狭窄的垫片可靠性上探测所引起的损伤，并指出在电气测试步骤中探测会引起有害的裂缝，从钝化中渗透到BEOL层，为水分进入提供了途径。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Probing impact on pad moisture tightness: A challenge for pad size reduction

This paper underlines the damages induced by probing on narrow pads reliability of specifically designed test structures placed on dicing streets and indicates that probing during electrical test steps provokes detrimental cracks diving from the passivation through the BEOL layers providing a path for moisture ingress.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS)

自引率

0.00%

发文量