柠檬酸表面改性对Cu与Sn-Cu合金无钎焊的影响

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521837

M. Hayakawa, S. Koyama, I. Shohji

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引用次数: 0

摘要

研究了柠檬酸对铜和锡箔表面改性对无熔剂真空连接铜接头强度和组织的影响。在表面改性的接头中，接头强度随粘接温度和粘接时间的增加而增加。表面改性后的接头强度偏差比未进行表面改性的接头小得多。在不进行表面改性的情况下，在接头中形成坚固的接头界面。反之，在与之结合的节理中形成相对光滑的节理界面。结果表明，柠檬酸对铜和锡箔进行表面改性，对稳定焊点的可靠性有一定的作用。

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Effect of surface modification by citric acid on fluxless vacuum bonding of Cu with Sn-Cu alloy

The effect of surface modification of Cu and solder foil by citric acid was investigated on the joint strength and the microstructure of the fluxless vacuum bonded Cu joint. In the joint with surface modification, the joint strength increases with increasing bonding temperature and time. The deviation of the joint strength in the joint with surface modification is very lower compared to that of the joint without it. The rugged joint interface forms in the joint without surface modification. On the contrary, the relative smooth joint interface forms in the joint with it. It was clarified that surface modification of Cu and solder foil by citric acid has an effect to stabilize the reliability of the joint.

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2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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