{"title":"超越规模——教老狗一些新把戏[半导体技术]","authors":"S. Iyer","doi":"10.1109/IPFA.2007.4378071","DOIUrl":null,"url":null,"abstract":"While the semiconductor industry has been focused on the challenges of scaling, it has become quite apparent that one must take a broader view of delivering productivity and performance gains in this new regime of non- classical scaling. While transistor level and interconnect performance will continue to make strides through the innovative use of stress engineering, novel materials such as high k dielectrics in the front end and low k dielectrics and high conductivity interconnects in the backend, there is much more to be gained by addressing the issues of memory integration, on- chip decoupling and autonomic chip functions.","PeriodicalId":334987,"journal":{"name":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"5 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Beyond scaling - teaching the old dog some new tricks [Semiconductor technology]\",\"authors\":\"S. Iyer\",\"doi\":\"10.1109/IPFA.2007.4378071\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"While the semiconductor industry has been focused on the challenges of scaling, it has become quite apparent that one must take a broader view of delivering productivity and performance gains in this new regime of non- classical scaling. While transistor level and interconnect performance will continue to make strides through the innovative use of stress engineering, novel materials such as high k dielectrics in the front end and low k dielectrics and high conductivity interconnects in the backend, there is much more to be gained by addressing the issues of memory integration, on- chip decoupling and autonomic chip functions.\",\"PeriodicalId\":334987,\"journal\":{\"name\":\"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"5 3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2007.4378071\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2007.4378071","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Beyond scaling - teaching the old dog some new tricks [Semiconductor technology]
While the semiconductor industry has been focused on the challenges of scaling, it has become quite apparent that one must take a broader view of delivering productivity and performance gains in this new regime of non- classical scaling. While transistor level and interconnect performance will continue to make strides through the innovative use of stress engineering, novel materials such as high k dielectrics in the front end and low k dielectrics and high conductivity interconnects in the backend, there is much more to be gained by addressing the issues of memory integration, on- chip decoupling and autonomic chip functions.