塑料封装“加固”和热增强的成本/性能分析

L. Nguyen, D. Tracy, A. Chen, R. Giberti, J. Hatch, J. DeRosa, B. Werner
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引用次数: 0

摘要

塑料包装联盟(PPC)是由DARPA根据SOL 94-27资助的技术再投资项目(TRP),旨在满足建立和加强“坚固”,热增强和高密度低成本塑料包装的岸上基础设施所需的需求。PPC现在是一个为期两年的项目的第二年。在与包装材料有关的各个领域取得了一些技术进步。然而,这种进步通常需要付出更高的代价。该计划的目的是确定这些先进技术的各种组合,以便降低总拥有成本,即使一揽子计划的个别要素可能会产生更高的成本。本讲座将讨论PPC正在评估的两种武器的成本/性能分析,即封装“加固”和封装“热增强”。“加固”是指加强塑料包装,以承受表面安装的严谨性,而不需要对部件进行干燥装袋和烘烤,以避免爆米花。“热增强”是指在不使用外部散热器的情况下需要更高的散热。SEMATECH的成本资源模型(CRM)用于分析这两个重点领域所涉及的流程流。我们将根据所达到的性能水平来讨论各种包增强组合的拥有成本。IBIS Associates的技术成本模型(TCM)应用于电路板组装级处理湿度敏感设备的流程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cost/performance analysis for plastic package "ruggedization" and thermal enhancement
The Plastic Packaging Consortium (PPC), a Technology Reinvestment Project (TRP) funded by DARPA under SOL 94-27 addresses the needs required to build up and strengthen an on-shore infrastructure for "ruggedized", thermally enhanced and high density low-cost plastic packages. The PPC is now in the second year of a two-year program. A number of technical advances has been made in various areas related to the materials of construction of the packages. However, such advances typically come at higher costs. The intention of the Program is to identify the various combinations of such advances so that the total cost of ownership would be reduced even though individual elements of the package may incur higher costs. This talk will discuss the cost/performance analysis for two arms under evaluation by the PPC, namely, package "ruggedization" and package "thermal enhancement." "Ruggedization" refers to the strengthening of the plastic package to withstand the rigor of surface mounting without the need for dry bagging and baking the parts to avoid popcorning. "Thermal enhancement" refers to the need for higher heat dissipation without resorting to external heat sinks. SEMATECH's Cost Resources Model (CRM) was used to analyze the process flows involved for these two Focus Areas. The cost of ownership for the various combinations of package enhancement will be discussed with respect to the performance level achieved. IBIS Associates's Technical Cost Model (TCM) was applied for the flow of handling moisture sensitive devices at the board assembly level.
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