圆片级TSV连接测试采用环形振荡器方案

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI:10.1109/EPEPS.2012.6457883

J. Pak, Jonghyun Cho, Joohee Kim, Heegon Kim, Kiyeong Kim, Joungho Kim, Junho Lee, Kunwoo Park

{"title":"圆片级TSV连接测试采用环形振荡器方案","authors":"J. Pak, Jonghyun Cho, Joohee Kim, Heegon Kim, Kiyeong Kim, Joungho Kim, Junho Lee, Kunwoo Park","doi":"10.1109/EPEPS.2012.6457883","DOIUrl":null,"url":null,"abstract":"This paper presents the wafer-lvel TSV connectivity test method using ring oscillator scheme by showing its good immunity to TSV and chip process variations, efficient use of a chip area, simplicity of the test circuitry design, and low cost from its application before expensive wafer thinning and stacking processes. The proposed method can detect a delamination failure between TSVs and back end lines on a single TSV processed wafer.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Wafer-level TSV connectivity test using ring oscillator scheme\",\"authors\":\"J. Pak, Jonghyun Cho, Joohee Kim, Heegon Kim, Kiyeong Kim, Joungho Kim, Junho Lee, Kunwoo Park\",\"doi\":\"10.1109/EPEPS.2012.6457883\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the wafer-lvel TSV connectivity test method using ring oscillator scheme by showing its good immunity to TSV and chip process variations, efficient use of a chip area, simplicity of the test circuitry design, and low cost from its application before expensive wafer thinning and stacking processes. The proposed method can detect a delamination failure between TSVs and back end lines on a single TSV processed wafer.\",\"PeriodicalId\":188377,\"journal\":{\"name\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2012.6457883\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457883","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

本文提出了一种基于环形振荡器的晶圆级TSV连通性测试方法，该方法对TSV和芯片工艺变化具有良好的抗扰性，有效地利用了芯片面积，测试电路设计简单，并且在昂贵的晶圆减薄和堆叠工艺之前应用成本低。该方法可以检测到单片TSV加工晶圆上TSV和后端线之间的分层故障。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Wafer-level TSV connectivity test using ring oscillator scheme

This paper presents the wafer-lvel TSV connectivity test method using ring oscillator scheme by showing its good immunity to TSV and chip process variations, efficient use of a chip area, simplicity of the test circuitry design, and low cost from its application before expensive wafer thinning and stacking processes. The proposed method can detect a delamination failure between TSVs and back end lines on a single TSV processed wafer.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

自引率

0.00%

发文量