大型QFN封装成型技术开发

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746720

JW Seah, Sw Wang

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引用次数: 6

摘要

与普通的小型QFN封装相比，大型QFN封装(> 5 × 5mm)的封装非常具有挑战性，因为引线框中的大模垫和引线之间的多个窄间隙可能导致半蚀刻区域的模具空隙排斥。高密度的易碎线材也容易产生扫线现象，因为EMC流对较长线材的影响较大，在充模过程中会产生扫线现象。

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Molding technology development of large QFN packages

Encapsulation of large QFN packages (> 5 × 5mm) are quite challenging as compared to normal small QFN packages as the big die pad in leadframe and multiple narrow gaps between leads may caused mold void rejects at the half etch areas. High density of fragile wires is prone to have wire sweep too as the EMC flow impact on longer wire length is significant which can caused wires sweep during mold filling.

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2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

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