{"title":"2D还是3D?将两者结合在一个x射线系统中的好处","authors":"U. E. Frank","doi":"10.1109/IEMT.2003.1225933","DOIUrl":null,"url":null,"abstract":"Optimum flexibility in X-ray inspection is achieved by combining 2D real-time imaging with 3D Axial Computed Tomography (ACT) in a single system. Switching from one mode to the other takes only a keystroke; and the selection can be made anytime - and as often as required - during the inspection process. The role played by X-ray systems in the inspection of electronic assemblies - especially today's printed circuit boards, densely packed with area array components - is well understood. Unlike machine vision and optical inspection equipment, X-ray systems penetrate materials to expose hidden solder joints on area array devices, such as flip chips and BGAs. Once a need for X-ray inspection equipment has been determined, the next question is \"which is best for the application, two dimensional (2D) or three dimensional (3D)?\".","PeriodicalId":106415,"journal":{"name":"IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-07-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"2D or 3D? benefits of combining both in a single X-ray system\",\"authors\":\"U. E. Frank\",\"doi\":\"10.1109/IEMT.2003.1225933\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Optimum flexibility in X-ray inspection is achieved by combining 2D real-time imaging with 3D Axial Computed Tomography (ACT) in a single system. Switching from one mode to the other takes only a keystroke; and the selection can be made anytime - and as often as required - during the inspection process. The role played by X-ray systems in the inspection of electronic assemblies - especially today's printed circuit boards, densely packed with area array components - is well understood. Unlike machine vision and optical inspection equipment, X-ray systems penetrate materials to expose hidden solder joints on area array devices, such as flip chips and BGAs. Once a need for X-ray inspection equipment has been determined, the next question is \\\"which is best for the application, two dimensional (2D) or three dimensional (3D)?\\\".\",\"PeriodicalId\":106415,\"journal\":{\"name\":\"IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-07-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2003.1225933\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2003.1225933","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
2D or 3D? benefits of combining both in a single X-ray system
Optimum flexibility in X-ray inspection is achieved by combining 2D real-time imaging with 3D Axial Computed Tomography (ACT) in a single system. Switching from one mode to the other takes only a keystroke; and the selection can be made anytime - and as often as required - during the inspection process. The role played by X-ray systems in the inspection of electronic assemblies - especially today's printed circuit boards, densely packed with area array components - is well understood. Unlike machine vision and optical inspection equipment, X-ray systems penetrate materials to expose hidden solder joints on area array devices, such as flip chips and BGAs. Once a need for X-ray inspection equipment has been determined, the next question is "which is best for the application, two dimensional (2D) or three dimensional (3D)?".