{"title":"非暴露模垫封装背面机械解封方法的样品制备及有效失效分析","authors":"Ong Pei Hoon, N. Kay, Gwee Hoon Yen","doi":"10.1109/IPFA.2018.8452566","DOIUrl":null,"url":null,"abstract":"Exposing the die backside is an important step in backside analysis. One of the most common techniques used is chemical preparation. However, the drawback of this technique for small non-exposed die pad package is that the copper lead will over etch by the 65% Acid Nitric Fuming if the device is not proper sealed with 3M High Temperature Tape. As a result, not able to proceed to further electrical measurements In view of this the mechanical decapsulation is an alternative solution to the existing procedure on the non-exposed die pad backside preparation. The end result of this technique is that the copper lead is intact and electrical measurement can be performed to improve the effectiveness and accuracy of physical failure analysis.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Sample Preparation on Backside Mechanical Decapsulation Methodology for Effective Failure Analysis on Non-Exposed Die Pad Package\",\"authors\":\"Ong Pei Hoon, N. Kay, Gwee Hoon Yen\",\"doi\":\"10.1109/IPFA.2018.8452566\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Exposing the die backside is an important step in backside analysis. One of the most common techniques used is chemical preparation. However, the drawback of this technique for small non-exposed die pad package is that the copper lead will over etch by the 65% Acid Nitric Fuming if the device is not proper sealed with 3M High Temperature Tape. As a result, not able to proceed to further electrical measurements In view of this the mechanical decapsulation is an alternative solution to the existing procedure on the non-exposed die pad backside preparation. The end result of this technique is that the copper lead is intact and electrical measurement can be performed to improve the effectiveness and accuracy of physical failure analysis.\",\"PeriodicalId\":382811,\"journal\":{\"name\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"79 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2018.8452566\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452566","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Sample Preparation on Backside Mechanical Decapsulation Methodology for Effective Failure Analysis on Non-Exposed Die Pad Package
Exposing the die backside is an important step in backside analysis. One of the most common techniques used is chemical preparation. However, the drawback of this technique for small non-exposed die pad package is that the copper lead will over etch by the 65% Acid Nitric Fuming if the device is not proper sealed with 3M High Temperature Tape. As a result, not able to proceed to further electrical measurements In view of this the mechanical decapsulation is an alternative solution to the existing procedure on the non-exposed die pad backside preparation. The end result of this technique is that the copper lead is intact and electrical measurement can be performed to improve the effectiveness and accuracy of physical failure analysis.