RESURF技术综述

A. Ludikhuize
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引用次数: 323

摘要

RESURF (Reduced Surface Field)技术是横向高电压、低导通电阻器件设计中应用最广泛的方法之一。该技术允许集成高压器件,范围从20v到1200v,双极和MOS晶体管。对该技术近20年来的发展进行了技术回顾。本文讨论了本发明及其在分立器件、连接隔离集成电路和SOI以及多路复用中的应用。它包括对击穿、导通电阻、高侧和高电流效应以及可靠性等主题的评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A review of RESURF technology
RESURF (Reduced Surface Field) technology is one of the most widely-used methods for the design of lateral high-voltage, low on-resistance devices. The technique has allowed the integration of HV devices, ranging from 20 V to 1200 V, with bipolar and MOS transistors. A technical review is given on the technology as developed during the last 20 years. The paper discusses the invention and its application in discrete devices, in Junction-Isolated IC's and SOI, and as Multiple Resurf. It includes an evaluation of topics like breakdown, on-resistance, high-side and high-current effects and reliability.
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