电子冷却的湍流模型:综述

K. Dhinsa, C. Bailey, K. Pericleous
{"title":"电子冷却的湍流模型:综述","authors":"K. Dhinsa, C. Bailey, K. Pericleous","doi":"10.1109/EMAP.2005.1598275","DOIUrl":null,"url":null,"abstract":"This paper is intended to provide a general review of the current capabilities of turbulence models within the specific area of electronic cooling. The work discussed in this paper is aimed at examining currently available turbulence models and the formulation of a new two-layer hybrid k/spl epsiv//kl model which is specifically designed for electronic application areas. A classic backward facing step configuration was used to evaluate the performance of the turbulence models in the prediction of separated flows. The preliminary results suggest that the hybrid k/spl epsiv//kl turbulence model is a promising zonal model to pursue.","PeriodicalId":352550,"journal":{"name":"2005 International Symposium on Electronics Materials and Packaging","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Turbulence modelling for electronic cooling: a review\",\"authors\":\"K. Dhinsa, C. Bailey, K. Pericleous\",\"doi\":\"10.1109/EMAP.2005.1598275\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper is intended to provide a general review of the current capabilities of turbulence models within the specific area of electronic cooling. The work discussed in this paper is aimed at examining currently available turbulence models and the formulation of a new two-layer hybrid k/spl epsiv//kl model which is specifically designed for electronic application areas. A classic backward facing step configuration was used to evaluate the performance of the turbulence models in the prediction of separated flows. The preliminary results suggest that the hybrid k/spl epsiv//kl turbulence model is a promising zonal model to pursue.\",\"PeriodicalId\":352550,\"journal\":{\"name\":\"2005 International Symposium on Electronics Materials and Packaging\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Symposium on Electronics Materials and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMAP.2005.1598275\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Symposium on Electronics Materials and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMAP.2005.1598275","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

本文旨在提供湍流模型在电子冷却特定领域内的当前能力的一般审查。本文讨论的工作旨在研究目前可用的湍流模型和专门为电子应用领域设计的新的双层混合k/spl epsiv//kl模型的公式。采用一个经典的后面向阶跃结构来评价湍流模型在分离流动预测中的性能。初步结果表明,混合k/spl / epsiv//kl湍流模式是一种值得研究的纬向湍流模式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Turbulence modelling for electronic cooling: a review
This paper is intended to provide a general review of the current capabilities of turbulence models within the specific area of electronic cooling. The work discussed in this paper is aimed at examining currently available turbulence models and the formulation of a new two-layer hybrid k/spl epsiv//kl model which is specifically designed for electronic application areas. A classic backward facing step configuration was used to evaluate the performance of the turbulence models in the prediction of separated flows. The preliminary results suggest that the hybrid k/spl epsiv//kl turbulence model is a promising zonal model to pursue.
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