采用新型无铅焊料合金,提高晶圆级封装的TCOB寿命

Xueren Zhang, W. Goh, K. Wong, D. Yap, K. Goh
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引用次数: 1

摘要

在封装尺寸、成本和性能最小化的驱动下,晶圆级封装(WLCSP)是目前半导体封装行业中增长最快的领域之一。WLP是直接安装在印刷电路板(PCB)板上的硅芯片,而不是带有衬底中间层的塑料BGA。硅与有机之间较大的CTE(热膨胀系数)失配导致焊点应力非常高,这将降低焊点的TCOB(板上热循环)寿命。因此,TCOB寿命是WLCSP的主要挑战之一,特别是对于大型模具。本研究的重点是在面对不断增加的模具尺寸要求时,提高WLCSP的TCOB寿命。选取不同尺寸的wlcsp作为试验车辆。为了更好地了解TCOB的性能,优化封装设计,对其进行了力学仿真。进行了TCOB测试,以量化当前SAC-N焊料的实际寿命并验证仿真模型。为了提高寿命余量,特别是对于大尺寸封装,一种新的焊料SAC-Q进行了评估。初步结果表明,SAC-Q表现出显著的TCOB改善和可接受的跌落测试性能。通过建立仿真模型来了解SAC-Q和SAC-N的不同行为。与SAC-N相比,SAC-Q中较低的塑性功与其较长的使用寿命密切相关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhance TCOB life for wafer level package with a new leadfree solder alloy
Driven by minimized package size, cost as well as performance, wafer level package (WLCSP) is currently one of the fastest growing segments in the semiconductor packaging industry. Not as plastic BGA with a substrate interposer, WLP is a silicon chip directly mounted on printed circuit board (PCB) board. The large CTE(coefficient of thermal expansion) mismatch between silicon and organic leads to very high solder joint stress, which will decrease TCOB(thermal cycling on board) life for solder joints. Thus TCOB life is one of the main challenges on WLCSP, especially with large die. This study is focused on enhancement of TCOB life for WLCSP in the face of increasing die-size requirements. Several WLCSPs with different size are selected as test vehicles. Mechanical simulation has been carried out to understand the TCOB behavior and help to optimize the package design. TCOB test has been done to quantify the real life and to validate the simulation models for current SAC-N solder. To enhance the life margin, especially for large size package, a new Solder SAC-Q has been evaluated. Initial results indicate SAC-Q is showing remarkable TCOB improvement with acceptable drop test performance. Simulation model has been built up to understand the different behavior between SAC-Q and SAC-N. Much lower plastic work in SAC-Q correlates well to its longer life than SAC-N.
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