故障隔离使用FIB辅助光子发射显微镜分析和微探针分析

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2011-07-04 DOI:10.1109/IPFA.2011.5992737

Gaojie Wen, Binghai Liu, W. Wang, Jinglong Li, Li Tian, Xuezhu Wang

{"title":"故障隔离使用FIB辅助光子发射显微镜分析和微探针分析","authors":"Gaojie Wen, Binghai Liu, W. Wang, Jinglong Li, Li Tian, Xuezhu Wang","doi":"10.1109/IPFA.2011.5992737","DOIUrl":null,"url":null,"abstract":"OBIRCH/EMMI and microprobe analysis were widely used to isolate failed device. But routine failure isolation method may not find the leakage path on some special functional failure cases. Two cases were presented to show a useful failure isolation strategy—FIB assisted photon emission analysis and microprobe by performing simulation or removing the load effect.","PeriodicalId":312315,"journal":{"name":"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Failure isolation using FIB assist Photon Emission Microscopy analysis and microprobe analysis\",\"authors\":\"Gaojie Wen, Binghai Liu, W. Wang, Jinglong Li, Li Tian, Xuezhu Wang\",\"doi\":\"10.1109/IPFA.2011.5992737\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"OBIRCH/EMMI and microprobe analysis were widely used to isolate failed device. But routine failure isolation method may not find the leakage path on some special functional failure cases. Two cases were presented to show a useful failure isolation strategy—FIB assisted photon emission analysis and microprobe by performing simulation or removing the load effect.\",\"PeriodicalId\":312315,\"journal\":{\"name\":\"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-07-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2011.5992737\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2011.5992737","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

摘要

OBIRCH/EMMI和微探针分析被广泛用于分离失效器件。但在一些特殊的功能故障情况下，常规的故障隔离方法可能找不到泄漏路径。通过模拟或去除负载效应，给出了一种有效的故障隔离策略——fib辅助光子发射分析和微探针。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Failure isolation using FIB assist Photon Emission Microscopy analysis and microprobe analysis

OBIRCH/EMMI and microprobe analysis were widely used to isolate failed device. But routine failure isolation method may not find the leakage path on some special functional failure cases. Two cases were presented to show a useful failure isolation strategy—FIB assisted photon emission analysis and microprobe by performing simulation or removing the load effect.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量