PECVD制备的a-SiGe: H薄膜沉积后退火提高掺杂效率

Ernesto Franco, A. Torres, M. Moreno
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引用次数: 0

摘要

一个可接受的热电效率与一个优值ZT $\geq 1$有关,其值随着塞贝克系数和电导率的高值而增加,而随着导热系数的低值而增加。非晶SiGe:H具有较高的塞贝克系数和较低的导热系数,要成为良好的热电材料只需要具有较高的导电性,因此本工作证明了高掺杂的a- SiGe:H型P和N薄膜通过退火提高了导电性。膜的电导率值最高的是4% of doping in gas phase. The P and N type samples were doped in the range from 4% to 16% with Boron and Phosphorus. After thermal treatment, both had an increase in their electrical conductivity value of three and two order of magnitude respectively. Also, the explanation of the activation mechanism of both impurities is given.
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Increasing the doping efficiency by post-deposition annealing in a-SiGe: H films synthesized by PECVD
An acceptable thermoelectric efficiency is related to a figure of merit ZT $\geq 1$, its value increases with a high value of Seebeck coefficient and electrical conductivity, and with a low thermal conductivity. The amorphous SiGe:H has a high Seebeck coefficient and low thermal conductivity, the only thing that they need to become a good thermoelectric material is a high electrical conductivity, for this reason the present work demonstrates the increase of the electrical conductivity of highly doped films of a- SiGe:H types P and N by annealing. The highest electrical conductivity value of the films was found in 4% of doping in gas phase. The P and N type samples were doped in the range from 4% to 16% with Boron and Phosphorus. After thermal treatment, both had an increase in their electrical conductivity value of three and two order of magnitude respectively. Also, the explanation of the activation mechanism of both impurities is given.
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