一种基于FINFET工艺的新型6T SRAM存储单元

Yaqi Ma, Lijun Zhang, Jinchen Liu
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引用次数: 1

摘要

随着半导体工艺的发展,CMOS电路尺寸不断缩小,体硅工艺已经难以满足器件和电路对性能和功耗的要求。与此同时,FINFET工艺因其优越的性能、功率效率和可扩展性而如雨后春笋般涌现并取代了平面MOSFET。本文尝试设计一种基于FINFET工艺将PG晶体管由NMOS转换为PMOS的6T SRAM存储单元。由于相同尺寸的PMOS驱动能力接近甚至超过NMOS,因此PMOS SRAM存储单元在面积、速度和功耗方面都是有利的。从仿真结果可以看出,虽然我们的新设计可以提高读写速度和写入余量(WM),但在较差的拐角处,读取静态噪声余量(RSNM)会变差。因此,需要读辅助电路来提高RSNM。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A New 6T SRAM Memory Cell Based on FINFET Process
With the development of semiconductor process, CMOS circuit size continues to shrink and the bulk silicon process has been difficult to meet the performance and power requirements of devices and circuits. At the same time, FINFET process has sprung up and replaced planar MOSFET due to their superior performance, power efficiency and scalability. The paper attempts to design a 6T SRAM memory cell in which it change PG transistors from NMOS to PMOS based on FINFET process. The PMOS SRAM memory cell is beneficial to area, speed and power consumption because the same size of PMOS drive capability is close to or even exceeds NMOS. From the results of simulation, we can see that although our new design can improve read and write speed and write margin (WM), the read static-noise margin (RSNM) deteriorates in worse corners. Hence, it need read assist circuits to improve RSNM.
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