The scope of applicability of DPL model to the heat transfer in electronic devices and integrated circuits

This paper presents the scope of applicability of Dual-Phase-Lag heat transfer model in electronic devices as-well-as in integrated circuits. Moreover, the investigation of necessity of use the Dual-Phase-Lag approach, instead of the classical Fourier-Kirchhoff model, to heat transfer modelling is included. In order to obtain the mentioned scope of applicability both analyzed thermal model has been used for the transistor elementary cells including the FinFET technology as-well-as power devices e.g. unipolar (MOSFET, VDMOS), bipolar and insulated gate bipolar transistors (IGBT)-SiC merged power diode. The received simulation results have been thoroughly-compared and analyzed in detail.