宽带多层LTCC微带到带线转换的电气性能设计

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396661

Huei-Han Jhuang, Tian-Wei Huang

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引用次数: 13

摘要

为了提高多层LTCC衬底微带到带状转换的宽带性能，提出了一种高阻抗补偿技术。在过渡线和50 /spl ω /传输线之间增加一段高阻抗传输线，以诱导额外的电感，以补偿过渡线的电容。本文利用HFSS对不同长度和宽度的高阻抗传输线进行了仿真，并对其电性能进行了优化比较，在直流至70 GHz频段内回波损耗优于17 dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design for electrical performance of wideband multilayer LTCC microstrip-to-stripline transition

A high impedance compensation technique is proposed to improve the wideband performance of the microstrip-to-stripline transition for multilayer LTCC substrate. A section of high impedance transmission line, which induces additional inductance, is added between the transition and 50 /spl Omega/ transmission line to compensate the capacitance of the transition. In the paper, various lengths and widths of the high impedance transmission line are simulated by HFSS and compared to optimize the electrical performance which achieves a return loss better than 17 dB over a band from DC to 70 GHz.

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来源期刊

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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