两相推挽式冷却模块在引脚鳍阵列电子器件中的应用

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 1992-02-03 DOI:10.1109/STHERM.1992.172844

Chao Yu-Lin, Chao Fang-Lin

{"title":"两相推挽式冷却模块在引脚鳍阵列电子器件中的应用","authors":"Chao Yu-Lin, Chao Fang-Lin","doi":"10.1109/STHERM.1992.172844","DOIUrl":null,"url":null,"abstract":"A two-phase push-pull cooling module has been developed for cooling a pin-fin array electronic device. The measured results indicate that when the pin-fin array density is increased the performance of the push-pull module is better than that of traditional forced convection. It was also found that in forced convection cooling the temperature in the downstream region is much higher than that of the front region. In comparison, the temperature distribution in the two-phase push-pull cooling module is quite uniform.<<ETX>>","PeriodicalId":301455,"journal":{"name":"[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"147 11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The application of two-phase push-pull cooling module in pin-fin array electronic device\",\"authors\":\"Chao Yu-Lin, Chao Fang-Lin\",\"doi\":\"10.1109/STHERM.1992.172844\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A two-phase push-pull cooling module has been developed for cooling a pin-fin array electronic device. The measured results indicate that when the pin-fin array density is increased the performance of the push-pull module is better than that of traditional forced convection. It was also found that in forced convection cooling the temperature in the downstream region is much higher than that of the front region. In comparison, the temperature distribution in the two-phase push-pull cooling module is quite uniform.<<ETX>>\",\"PeriodicalId\":301455,\"journal\":{\"name\":\"[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"147 11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-02-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.1992.172844\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1992.172844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

研制了一种两相推拉式冷却模块，用于对针鳍阵列电子器件进行冷却。实测结果表明，当引脚阵列密度增大时，推挽式模块的性能优于传统的强制对流。在强迫对流冷却中，下游区域的温度远高于锋面区域。相比之下，两相推拉式冷却模块的温度分布相当均匀

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

The application of two-phase push-pull cooling module in pin-fin array electronic device

A two-phase push-pull cooling module has been developed for cooling a pin-fin array electronic device. The measured results indicate that when the pin-fin array density is increased the performance of the push-pull module is better than that of traditional forced convection. It was also found that in forced convection cooling the temperature in the downstream region is much higher than that of the front region. In comparison, the temperature distribution in the two-phase push-pull cooling module is quite uniform.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

自引率

0.00%

发文量