[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Determination of appropriate thermal transport properties for electronics applications

Pub Date : 1992-02-03 DOI: 10.1109/STHERM.1992.172865 R. Tye, A. Maesono

Re-entrant cavity heat sinks formed by anisotropic etching and silicon direct wafer bonding

Pub Date : 1992-02-03 DOI: 10.1109/STHERM.1992.172863 A. Goyal, R. Jaeger, S. Bhavnani, C. Ellis, N. Phadke, M. Azimi-Rashti, J. Goodling

Using a thermal simulation model to interpret test data (air cooling of circuit boards)

Pub Date : 1992-02-03 DOI: 10.1109/STHERM.1992.172845 K. Azar, V. Manno