Using a thermal simulation model to interpret test data (air cooling of circuit boards)

K. Azar, V. Manno
{"title":"Using a thermal simulation model to interpret test data (air cooling of circuit boards)","authors":"K. Azar, V. Manno","doi":"10.1109/STHERM.1992.172845","DOIUrl":null,"url":null,"abstract":"The concurrent utilization of testing and simulation models is advocated as a means of improving the thermal characterization process. One such model based upon a combination of integral energy and momentum balances and local thermal networks is described. The general process of data interpretation using a simulation model is outlined as a series of guidelines. The process is illustrated through a series of tests involving air-cooling of boards with regular and irregular component layouts. Specific sensitivities tested included component powering, component height, and arrangement heterogeneity. The treatments of the convective heat transfer coefficient and the flow split among component flow channels were found to be the most important sensitivities in these tests. Using simulation models is considered to reduce uncertainties in estimating adiabatic heat transfer correlations. Recommendations and guidance are provided for an innovative approach to thermal characterization using existing technology.<<ETX>>","PeriodicalId":301455,"journal":{"name":"[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1992.172845","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The concurrent utilization of testing and simulation models is advocated as a means of improving the thermal characterization process. One such model based upon a combination of integral energy and momentum balances and local thermal networks is described. The general process of data interpretation using a simulation model is outlined as a series of guidelines. The process is illustrated through a series of tests involving air-cooling of boards with regular and irregular component layouts. Specific sensitivities tested included component powering, component height, and arrangement heterogeneity. The treatments of the convective heat transfer coefficient and the flow split among component flow channels were found to be the most important sensitivities in these tests. Using simulation models is considered to reduce uncertainties in estimating adiabatic heat transfer correlations. Recommendations and guidance are provided for an innovative approach to thermal characterization using existing technology.<>
使用热模拟模型解释测试数据(电路板风冷)
试验模型与仿真模型的并行利用是改进热表征过程的一种手段。描述了一种基于积分能量和动量平衡以及局部热网的组合的这样的模型。使用模拟模型解释数据的一般过程概述为一系列指导方针。这一过程是通过一系列的测试,包括风冷板与规则和不规则的组件布局说明。特定敏感性测试包括组件功率,组件高度和排列异质性。对流换热系数的处理和组分流道间的分流是这些试验中最重要的敏感性。考虑使用模拟模型来减少估算绝热传热相关性时的不确定性。为利用现有技术进行热表征的创新方法提供了建议和指导
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