用焊丝粘结机粘结头进行原位球粘结剪切测量

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. Pub Date : 2003-07-16 DOI:10.1109/IEMT.2003.1225879

J. Medding, M. Mayer

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引用次数: 10

摘要

本文报道了一种利用键头运动在键合后直接与毛细管剪切球键的新型球键质量评价方法。利用粘结头电机控制器的力信号，得到一个与常规剪切测试设备上测得的球粘结剂剪切力相关的值。当剪切速度为100 /spl mu/m/ms，剪切时法向力为50 mN时，这种新方法在广泛的粘合条件下表现良好。对于常温下60 /spl mu/m的球节距工艺，相关系数大于0.95。研究了粘结后加热及其对该方法的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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In situ ball bond shear measurement using wire bonder bond head

A novel ball bond quality evaluation method is reported using bond head motion to shear the ball bond with the capillary directly after bonding. The bond head motor controller's force signal is used to obtain a value that correlates to the ball bond's shear force as measured on conventional shear test equipment. This new method performs well over a wide range of bonding conditions when using a shear speed of 100 /spl mu/m/ms and a normal force of 50 mN during shearing. For a 60 /spl mu/m ball pitch process bonded at ambient temperature, the correlation coefficient is greater than 0.95. Post-bond heating and its effect on this method have also been investigated.

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来源期刊

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.

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