铁电DRAM存储电容器可靠性测试的新方法

C. Sudhama, R. Khamankaar, Jiyoung Kim, B. Jiang, J. Lee, P. Maniar, Robert E. Jones, C. Mogab
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引用次数: 1

摘要

在开路条件下,开发了一种表征溶胶-凝胶衍生铁电薄膜中介电电压和电荷衰减时间(T/sub V/和T/sub Q/)的新技术。电压衰减可能对DRAM电容器中允许的最大刷新时间造成限制。这种直接测量T/sub V/的方法优于基于电流-电压关系的传统估算方法,因为它隐含了非线性和应力诱导的泄漏减少效应。未掺杂和镧掺杂的锆钛酸铅(PZT)薄膜还具有大信号偏振频散、位“0”弛豫和新近开发的新位“1”弛豫机制。建议任何用于DRAM应用的高介电常数介质的评估都必须包括这些测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel methods for the reliability testing of ferroelectric DRAM storage capacitors
A new technique has been developed for the characterization of dielectric voltage- and charge-decay times (T/sub V/ and T/sub Q/) in sol-gel derived ferroelectric films under open-circuit conditions. Voltage decay potentially poses a limitation on the maximum allowable refresh-time in the DRAM capacitor. This direct measurement of T/sub V/ is preferred to its conventional estimation based on the current-voltage relationship, because of the implicit inclusion of nonlinearities and stress-induced leakage-reduction effects. Undoped and lanthanum-doped lead-zirconate-titanate (PZT) films have also been characterized for frequency-dispersion in large-signal polarization, bit "0" relaxation and a new bit "1" relaxation mechanism using techniques developed recently. It is proposed that any evaluation of high-permittivity dielectrics for DRAM applications must include these measurements.<>
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