直接转移原子光滑的Au薄膜到电镀图案上，用于室温下的Au-Au键合

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947452

Y. Kurashima, A. Maeda, H. Takagi

{"title":"直接转移原子光滑的Au薄膜到电镀图案上，用于室温下的Au-Au键合","authors":"Y. Kurashima, A. Maeda, H. Takagi","doi":"10.23919/LTB-3D.2017.7947452","DOIUrl":null,"url":null,"abstract":"We demonstrate a direct transfer technique of Au thin layer onto electroplated Au surface from a surface of atomically smooth master wafer. An atomically smooth Au surface with a root mean square surface roughness of 0.6 nm could be transferred from the master wafer. We also examined its applicability to room-temperature Au-Au bonding in atmosphere. A high bonding strength of about 225 MPa was obtained.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air\",\"authors\":\"Y. Kurashima, A. Maeda, H. Takagi\",\"doi\":\"10.23919/LTB-3D.2017.7947452\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrate a direct transfer technique of Au thin layer onto electroplated Au surface from a surface of atomically smooth master wafer. An atomically smooth Au surface with a root mean square surface roughness of 0.6 nm could be transferred from the master wafer. We also examined its applicability to room-temperature Au-Au bonding in atmosphere. A high bonding strength of about 225 MPa was obtained.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947452\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947452","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

我们演示了一种将金薄层从原子光滑的母片表面直接转移到电镀金表面的技术。从主晶圆上转移出表面均方根粗糙度为0.6 nm的原子光滑金表面。并考察了其在室温气氛下的金-金键合的适用性。获得了约225 MPa的高结合强度。

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Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air

We demonstrate a direct transfer technique of Au thin layer onto electroplated Au surface from a surface of atomically smooth master wafer. An atomically smooth Au surface with a root mean square surface roughness of 0.6 nm could be transferred from the master wafer. We also examined its applicability to room-temperature Au-Au bonding in atmosphere. A high bonding strength of about 225 MPa was obtained.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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