Micromachined Packaging for Ultrasonic Transducers with Particle Restraint Mechanisms

The ultrasonic transducer's micropackaging with particle pollution restraint mechanisms using micromachining process is proposed. The developed packaging with active dustproof mechanisms is very promising, because it permits the advantages of shielding, protection, reliability and signal connection. Technical approaches to the capacitive micro-ultrasonic transducer packaging are divided into three parts: micromachining cap structures, die attachments, and dustproof mechanisms. Simulations for handling the packaging issues are relatively developed. Features of the technology for restraint electrodes on microcap are described. The measurements for various physical and electrical parameters and the packaging needed to make optimal measurements is given. Future directions and potentials of the packaging technology are discussed