{"title":"点缺陷对长互连线参数良率的影响","authors":"I. Wagner, I. Koren","doi":"10.1109/DFTVS.1995.476936","DOIUrl":null,"url":null,"abstract":"The effect of non-catastrophic (or soft) defects (i.e., neither short nor open) on long interconnection lines is analyzed and an estimate is derived for the frequency-dependent critical area for such lines. The analysis is based on a transmission-line model of interconnection lines, and the reflections caused by the defect are taken into account. This analysis results in an estimated prediction of the parametric yield, and a practical recommendation for a better jog insertion in VLSI routing.","PeriodicalId":362167,"journal":{"name":"Proceedings of International Workshop on Defect and Fault Tolerance in VLSI","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"The effect of spot defects on the parametric yield of long interconnection lines\",\"authors\":\"I. Wagner, I. Koren\",\"doi\":\"10.1109/DFTVS.1995.476936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The effect of non-catastrophic (or soft) defects (i.e., neither short nor open) on long interconnection lines is analyzed and an estimate is derived for the frequency-dependent critical area for such lines. The analysis is based on a transmission-line model of interconnection lines, and the reflections caused by the defect are taken into account. This analysis results in an estimated prediction of the parametric yield, and a practical recommendation for a better jog insertion in VLSI routing.\",\"PeriodicalId\":362167,\"journal\":{\"name\":\"Proceedings of International Workshop on Defect and Fault Tolerance in VLSI\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of International Workshop on Defect and Fault Tolerance in VLSI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DFTVS.1995.476936\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Workshop on Defect and Fault Tolerance in VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFTVS.1995.476936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The effect of spot defects on the parametric yield of long interconnection lines
The effect of non-catastrophic (or soft) defects (i.e., neither short nor open) on long interconnection lines is analyzed and an estimate is derived for the frequency-dependent critical area for such lines. The analysis is based on a transmission-line model of interconnection lines, and the reflections caused by the defect are taken into account. This analysis results in an estimated prediction of the parametric yield, and a practical recommendation for a better jog insertion in VLSI routing.