高度耐热的临时粘接/脱粘系统，无有机粘合剂，用于3D集成

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886153

H. Hashiguchi, T. Fukushima, M. Murugesan, J. Bea, H. Kino, K. Lee, T. Tanaka, M. Koyanagi

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引用次数: 1

摘要

本研究介绍了一种高度耐热的临时粘接/脱粘系统。已知的优质模具(kgd)通过SOG粘合到支撑晶圆上。对KGDs进行减薄处理，通过后孔/后孔工艺制备cu - tsv。通过准分子激光照射硅片上的a-Si:H层，可以很容易地将这些KGDs从硅片上剥离。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Highly thermoresistant temporary bonding/debonding system without organic adhesives for 3D integration

This study introduces a highly thermoresistant temporary bonding/debonding system. Known Good Dies (KGDs) were bonded through SOG to a support wafer. The KGDs were thinned, and Cu-TSVs were formed by via-last/backside-via processes. These KGDs can be readily debonded from the wafer by excimer laser irradiation to the a-Si:H layer on the wafer.

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来源期刊

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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