氮化硅外在缺陷与电容器可靠性

J. Scarpulla, E. E. King, J. V. Osborn
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引用次数: 0

摘要

在射频/微波mmic中实现的电容器似乎在许多情况下主导可靠性,而不是有源器件(phemt或hbt)本身。我们通过从公开文献中发表的数据中提取MIMCAP的外部缺陷密度来检查它。给出了从击穿时间或斜击穿电压概率图中提取缺陷密度的方法。我们已经注意到,在汇编的十几组数据中,外在密度变化很大。我们还提供了使用氢点状电容器的数据。利用这一行业范围内的数据,我们提供了一些基于外部可靠性的mmic电容器尺寸设计图表。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Si3N4 extrinsic defects and capacitor reliability
The capacitors implemented in RF/microwave MMICs seem to dominate the reliability in many cases, rather than the active devices (pHEMTs or HBTs) themselves. We have examined MIMCAP extrinsic defect density by extracting it from published data available in the open literature. The methodology for extracting defect densities from probability plots of times to breakdown or of ramped breakdown voltages is shown. We have noted that the extrinsic densities are quite varied across the dozen sets of data compiled. We also contributed data using Hg-dot-formed capacitors. Using this industry-wide data we provide some design charts for the sizing of capacitors in MMICs based upon their extrinsic reliability.
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