{"title":"系统级封装(SiP)技术的应用","authors":"W. Koh","doi":"10.1109/ICEPT.2005.1564753","DOIUrl":null,"url":null,"abstract":"System in package (SiP) and multichip package (MCP) in recent years have seen expanded applications in portable, consumer electronics as well as computing and telecommunications. Memory-related packages now occupy a large share of SiP. This paper uses the NAND and NOR flash memory technology and their SiP packages as example to illuminate the market trend and major applications of SiP. Some examples of SiP and MCP design for flash and SRAM, DRAM memory packages and digital memory cards are described as example. The manufacturing process, testing, cost, reliability concerns and future technology development outlook are discussed.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"System in package (SiP) technology applications\",\"authors\":\"W. Koh\",\"doi\":\"10.1109/ICEPT.2005.1564753\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"System in package (SiP) and multichip package (MCP) in recent years have seen expanded applications in portable, consumer electronics as well as computing and telecommunications. Memory-related packages now occupy a large share of SiP. This paper uses the NAND and NOR flash memory technology and their SiP packages as example to illuminate the market trend and major applications of SiP. Some examples of SiP and MCP design for flash and SRAM, DRAM memory packages and digital memory cards are described as example. The manufacturing process, testing, cost, reliability concerns and future technology development outlook are discussed.\",\"PeriodicalId\":234537,\"journal\":{\"name\":\"2005 6th International Conference on Electronic Packaging Technology\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 6th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2005.1564753\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564753","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
System in package (SiP) and multichip package (MCP) in recent years have seen expanded applications in portable, consumer electronics as well as computing and telecommunications. Memory-related packages now occupy a large share of SiP. This paper uses the NAND and NOR flash memory technology and their SiP packages as example to illuminate the market trend and major applications of SiP. Some examples of SiP and MCP design for flash and SRAM, DRAM memory packages and digital memory cards are described as example. The manufacturing process, testing, cost, reliability concerns and future technology development outlook are discussed.
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