{"title":"高速单端母线中减少串扰的沟槽地面结构分析","authors":"Mihai D. Rotaru, B. E. Cheah, J. Kong","doi":"10.1109/EPTC47984.2019.9026674","DOIUrl":null,"url":null,"abstract":"The near-end cross talk in high speed single ended bus configuration can have a negative effect of signal integrity. In this work a 3D trench on the reference plane is used to reduce the near-end cross talk in single ended bus. The electromagnetic principle behind the positive effects of the 3D trench ground are discussed and explained here. Also, the measurement results obtained for the fabricated test boards are presented showing a reduction of up to 40% in the near-end cross talk for the single ended bus routed above the 3D trench. Two different 3D trench designs are presented, and their advantages and limitations are discussed.","PeriodicalId":244618,"journal":{"name":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Analysis of trench ground structures for cross talk reduction in high speed single ended bus\",\"authors\":\"Mihai D. Rotaru, B. E. Cheah, J. Kong\",\"doi\":\"10.1109/EPTC47984.2019.9026674\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The near-end cross talk in high speed single ended bus configuration can have a negative effect of signal integrity. In this work a 3D trench on the reference plane is used to reduce the near-end cross talk in single ended bus. The electromagnetic principle behind the positive effects of the 3D trench ground are discussed and explained here. Also, the measurement results obtained for the fabricated test boards are presented showing a reduction of up to 40% in the near-end cross talk for the single ended bus routed above the 3D trench. Two different 3D trench designs are presented, and their advantages and limitations are discussed.\",\"PeriodicalId\":244618,\"journal\":{\"name\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC47984.2019.9026674\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC47984.2019.9026674","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of trench ground structures for cross talk reduction in high speed single ended bus
The near-end cross talk in high speed single ended bus configuration can have a negative effect of signal integrity. In this work a 3D trench on the reference plane is used to reduce the near-end cross talk in single ended bus. The electromagnetic principle behind the positive effects of the 3D trench ground are discussed and explained here. Also, the measurement results obtained for the fabricated test boards are presented showing a reduction of up to 40% in the near-end cross talk for the single ended bus routed above the 3D trench. Two different 3D trench designs are presented, and their advantages and limitations are discussed.
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