{"title":"新型SN-AG-CU钎料合金的高效认证方法","authors":"J. Masicat, C. Kumar, M. Nuda","doi":"10.1109/RELPHY.2007.369952","DOIUrl":null,"url":null,"abstract":"This poster presentation showcase the certification methodologies employed for Intel's cellular handheld products in qualifying the Sn-Ag-Cu solder alloy, SAC105, on wire bonded packages. SAC 105 which contains 98.5% tin, 1.0% silver and 0.5% copper was identified as another viable solution to enhance package solder joint reliability performance.","PeriodicalId":433104,"journal":{"name":"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"An Efficient Certification Approach for New SN-AG-CU Solder Alloy\",\"authors\":\"J. Masicat, C. Kumar, M. Nuda\",\"doi\":\"10.1109/RELPHY.2007.369952\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This poster presentation showcase the certification methodologies employed for Intel's cellular handheld products in qualifying the Sn-Ag-Cu solder alloy, SAC105, on wire bonded packages. SAC 105 which contains 98.5% tin, 1.0% silver and 0.5% copper was identified as another viable solution to enhance package solder joint reliability performance.\",\"PeriodicalId\":433104,\"journal\":{\"name\":\"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.2007.369952\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.2007.369952","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An Efficient Certification Approach for New SN-AG-CU Solder Alloy
This poster presentation showcase the certification methodologies employed for Intel's cellular handheld products in qualifying the Sn-Ag-Cu solder alloy, SAC105, on wire bonded packages. SAC 105 which contains 98.5% tin, 1.0% silver and 0.5% copper was identified as another viable solution to enhance package solder joint reliability performance.
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