污染对TAB带结构中铜迁移的影响

Proceedings of 1994 IEEE International Reliability Physics Symposium Pub Date : 1994-04-11 DOI:10.1109/RELPHY.1994.307852

D. Nieman

{"title":"污染对TAB带结构中铜迁移的影响","authors":"D. Nieman","doi":"10.1109/RELPHY.1994.307852","DOIUrl":null,"url":null,"abstract":"Copper migration in adhesive of Tape Automated Bonding (TAB) tape during biased moisture stress can cause failure. Experiments aimed at reducing copper migration show that copper precipitation lengths after HAST are linearly proportional to chloride concentration in the TAB tape material. Discharge potential measurements of TAB tape in 156 /spl deg/C bake are correlated to chloride concentration.<<ETX>>","PeriodicalId":276224,"journal":{"name":"Proceedings of 1994 IEEE International Reliability Physics Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Effect of contamination on copper migration in TAB tape structures\",\"authors\":\"D. Nieman\",\"doi\":\"10.1109/RELPHY.1994.307852\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Copper migration in adhesive of Tape Automated Bonding (TAB) tape during biased moisture stress can cause failure. Experiments aimed at reducing copper migration show that copper precipitation lengths after HAST are linearly proportional to chloride concentration in the TAB tape material. Discharge potential measurements of TAB tape in 156 /spl deg/C bake are correlated to chloride concentration.<<ETX>>\",\"PeriodicalId\":276224,\"journal\":{\"name\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1994.307852\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1994.307852","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 13

摘要

自动粘接(TAB)胶带在偏湿应力下的铜迁移会导致失效。旨在减少铜迁移的实验表明，HAST后的铜沉淀长度与TAB带材料中的氯化物浓度成线性正比。156 /spl℃高温下TAB带放电电位测量值与氯离子浓度相关

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Effect of contamination on copper migration in TAB tape structures

Copper migration in adhesive of Tape Automated Bonding (TAB) tape during biased moisture stress can cause failure. Experiments aimed at reducing copper migration show that copper precipitation lengths after HAST are linearly proportional to chloride concentration in the TAB tape material. Discharge potential measurements of TAB tape in 156 /spl deg/C bake are correlated to chloride concentration.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of 1994 IEEE International Reliability Physics Symposium

自引率

0.00%

发文量