{"title":"利用室温键合技术制造多片堆叠的偏移补偿波长转换器件","authors":"Yoshimi Ariga, T. Onda, Waka Kubota, I. Shoji","doi":"10.1109/LTB-3D.2014.6886158","DOIUrl":null,"url":null,"abstract":"We have developed new structured wavelength-conversion devices with stacked plates of β-BaB<sub>2</sub>O<sub>4</sub> using the room-temperature bonding technique. The output beam quality is improved, while the generated UV power becomes lower when thinner plates are used.","PeriodicalId":123514,"journal":{"name":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of walk-off compensating wavelength-conversion devices with stacks of multiple plates by use of room-temperature bonding\",\"authors\":\"Yoshimi Ariga, T. Onda, Waka Kubota, I. Shoji\",\"doi\":\"10.1109/LTB-3D.2014.6886158\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed new structured wavelength-conversion devices with stacked plates of β-BaB<sub>2</sub>O<sub>4</sub> using the room-temperature bonding technique. The output beam quality is improved, while the generated UV power becomes lower when thinner plates are used.\",\"PeriodicalId\":123514,\"journal\":{\"name\":\"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-07-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTB-3D.2014.6886158\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D.2014.6886158","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabrication of walk-off compensating wavelength-conversion devices with stacks of multiple plates by use of room-temperature bonding
We have developed new structured wavelength-conversion devices with stacked plates of β-BaB2O4 using the room-temperature bonding technique. The output beam quality is improved, while the generated UV power becomes lower when thinner plates are used.