基于离子注入超结结构的30-40 V超低导通电阻UMOSFET

Hisanori Okubo, Kenya Kobayashi, Y. Kawashima
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引用次数: 8

摘要

我们提出了一种最终窄间距超结UMOSFET (SJ-UMOS),具有创纪录的低比导通电阻(Rsp),用于汽车应用。该装置不仅缩小了横向p/n间距,而且减小了包括离子注入p柱在内的电压维持区域的纵向尺寸。经过改进的技术,我们得到了一个完全耗尽的SJ结构,其间距最小为1.0 μm。在所研制的SJ-UMOS中,在击穿电压为32.8 V时获得了4.75 miimm2(不含衬底组件时为2.95 miimm2)的超低Rsp (VGS = 10 V)。由于MOSFET栅极周围的最佳结构,我们还证实了低RonQG FOM和体二极管软恢复操作的优异性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultralow on-resistance 30–40 V UMOSFET by 2-D scaling of ion-implanted superjunction structure
We present an ultimately narrow pitch superjunction UMOSFET (SJ-UMOS) with a record low specific on-resistance (Rsp) for automotive applications. This high performance device was designed by not only shrinkage of lateral p/n pitch, but reduction of longitudinal dimension for voltage sustaining region including ion-implanted p-columns. The refined technologies brought us a fully depleted SJ structure with extremely scaled pitch to a minimum of 1.0 μm. In the developed SJ-UMOS, an ultralow Rsp (VGS = 10 V) of 4.75 miimm2 (2.95 miimm2 without a substrate component) at a breakdown voltage of 32.8 V was obtained. We also confirmed excellent properties of low RonQG FOM and soft recovery operation of a body diode due to the best architecture around the gate electrode of the MOSFET.
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