了解保护层损坏:失效分析到下一个层次

F.V. Abitan, R. C. Angeles, M. Fabia, R. Flores, C.B. Gabunas
{"title":"了解保护层损坏:失效分析到下一个层次","authors":"F.V. Abitan, R. C. Angeles, M. Fabia, R. Flores, C.B. Gabunas","doi":"10.1109/IPFA.2006.251024","DOIUrl":null,"url":null,"abstract":"Failure analysis (FA) is key in root cause identification for any problem solving journey. Diagnosis given provides insights on mechanisms by which failures occur. This helps in determining factors that lead to the failure and consequently the root cause, thus easier to provide corrective actions. In mid June 2004, a sudden increase in test fall-outs was encountered. Several devices from different product groups were affected. Fail modes reported were supply shorts and functional fails. FA on rejects showed PO damages with burnt metals as the physical defect of the rejects. PO damages are commonly induced mechanically. Burnt metals, on the other hand, are usually identified with electrical overstress (EOS) or electro-static discharge (ESD) related event. Both features were observed on inspected rejects; hence root-cause identification became a challenge. Conflicting views from counterparts added to the confusion. Experts in the US leaned on the EOS or ESD side of the case while counterparts in France maintained the mechanical angle of the issue. These conflicting inputs brought about different insights on different mechanisms leading to PO damages","PeriodicalId":283576,"journal":{"name":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Understanding Protective Overcoat Damages: Failure Analysis to the Next Level\",\"authors\":\"F.V. Abitan, R. C. Angeles, M. Fabia, R. Flores, C.B. Gabunas\",\"doi\":\"10.1109/IPFA.2006.251024\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Failure analysis (FA) is key in root cause identification for any problem solving journey. Diagnosis given provides insights on mechanisms by which failures occur. This helps in determining factors that lead to the failure and consequently the root cause, thus easier to provide corrective actions. In mid June 2004, a sudden increase in test fall-outs was encountered. Several devices from different product groups were affected. Fail modes reported were supply shorts and functional fails. FA on rejects showed PO damages with burnt metals as the physical defect of the rejects. PO damages are commonly induced mechanically. Burnt metals, on the other hand, are usually identified with electrical overstress (EOS) or electro-static discharge (ESD) related event. Both features were observed on inspected rejects; hence root-cause identification became a challenge. Conflicting views from counterparts added to the confusion. Experts in the US leaned on the EOS or ESD side of the case while counterparts in France maintained the mechanical angle of the issue. These conflicting inputs brought about different insights on different mechanisms leading to PO damages\",\"PeriodicalId\":283576,\"journal\":{\"name\":\"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2006.251024\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2006.251024","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

故障分析(FA)是任何问题解决过程中根本原因识别的关键。给出的诊断提供了对故障发生机制的见解。这有助于确定导致失败的因素,从而确定根本原因,从而更容易提供纠正措施。2004年6月中旬,试验放射性尘埃突然增加。来自不同产品组的几个设备受到了影响。故障模式报告是供应短缺和功能故障。对废品品的FA分析显示,废品品的物理缺陷为PO损伤,金属烧成。PO损伤通常是机械引起的。另一方面,燃烧的金属通常被识别为电气过度应力(EOS)或静电放电(ESD)相关事件。这两种特征都可以在被检验的次品上观察到;因此,找出根本原因成为一项挑战。来自同行的相互矛盾的观点加剧了混乱。美国的专家倾向于EOS或ESD方面,而法国的同行则坚持从机械角度解决问题。这些相互矛盾的输入带来了对导致PO损害的不同机制的不同见解
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Understanding Protective Overcoat Damages: Failure Analysis to the Next Level
Failure analysis (FA) is key in root cause identification for any problem solving journey. Diagnosis given provides insights on mechanisms by which failures occur. This helps in determining factors that lead to the failure and consequently the root cause, thus easier to provide corrective actions. In mid June 2004, a sudden increase in test fall-outs was encountered. Several devices from different product groups were affected. Fail modes reported were supply shorts and functional fails. FA on rejects showed PO damages with burnt metals as the physical defect of the rejects. PO damages are commonly induced mechanically. Burnt metals, on the other hand, are usually identified with electrical overstress (EOS) or electro-static discharge (ESD) related event. Both features were observed on inspected rejects; hence root-cause identification became a challenge. Conflicting views from counterparts added to the confusion. Experts in the US leaned on the EOS or ESD side of the case while counterparts in France maintained the mechanical angle of the issue. These conflicting inputs brought about different insights on different mechanisms leading to PO damages
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