利用等离子体处理树脂表面提高薄型SiP的防潮性能

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396593

Y. Kohara, R. Usui, A. Nishida, H. Mizuhara, T. Nakarrwra, S. Mori, N. Takakusaki, Y. Igarashi, Y. Inoue

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引用次数: 3

摘要

在缩小SiP(封装系统)厚度时，由于中间层和模具树脂之间界面的粘附性较弱，耐湿可靠性一直是一个严重的问题(Alpern等人，2003)。此外，由于无铅焊接过程中的高回流温度，SiP需要更高的耐热性。在这项工作中，我们用一种新的等离子体处理技术改善了粘附性能。它是用氩或氩氧混合等离子体处理由Cardo聚合物组成的PSR(光阻焊料)表面，与传统的PSR相比具有优异的耐热性。等离子体处理提高了PSR与模具树脂界面的粘附性能。从而提高了模块的防潮可靠性。等离子体处理后的PSR表面的SEM(扫描电子显微镜)图像显示，产生的投影引起锚定效应。XPS (x射线光电子能谱)表明，等离子体处理改变了PSR表面的化学结合态。从这些结果可以看出，锚点效应和化学键效应都提高了PSR/模具树脂界面的粘附性能。因此，通过等离子体处理工艺的附着力改善和采用高度耐热的cardo聚合物PSR，可以小型化优良的防潮耐热SiP

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Improvement in moisture resistance of thin SiP utilizing the plasma treatment of resin surface

In downsizing the SiP (system in package) thickness, moisture resistance reliability has been a serious problem, because of the weak adhesion property of the interface between the interposer and mold resin (Alpern et al., 2003). Also, the SiP requires more heat resistance because of the high reflow temperature in the lead free solder process. In this work, we have improved the adhesion property with a new plasma treatment technology. It is argon or argon-oxygen mixture plasma treatment of PSR (photo solder resist) surface composed of Cardo polymer which has excellent heat resistance compared to the conventional PSR. The plasma treatment improved the adhesion property of the interface between this PSR and mold resin. As a result, the moisture resistance reliability of the module was improved. SEM (scanning electron microscope) images of the PSR surface treated with plasma showed the generation of projections caused the anchor effect. XPS (X-ray photoelectron spectroscopy) spectra indicated that the plasma treatment changed the chemical combined states of the PSR surface. From these results, both the anchor effect and the chemical bond effect increased the adhesion property at the PSR/mold resin interface. Therefore, with the adhesion improvement from the plasma treatment process and by adopting a highly heat resistant cardo polymer PSR it is possible to miniaturize a fine moisture-resistant and heat-resistant SiP

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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