通过传统Pad采用Via-last-from-top方法进行3D互连

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Pub Date : 2019-12-01 DOI:10.1109/EPTC47984.2019.9026632

H. Li, Ling Xie, S. Chong

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引用次数: 1

摘要

为了缩短3D生产时间，成功设计、开发了TSV腔和传统Al衬垫上的TSV，并通过VLFT方法进行了3D连接。在组装完成后，对TSV腔和三维堆叠TSV的电连接进行了表征和报道。

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3D Interconnect through Conventional Pad by Via-last-from-top Approach

To reduce 3D production time, TSV cavity and TSV on conventional Al pads were successfully designed, developed and demonstrated for 3D connection by via-last-from-top (VLFT) approach. Electrical connection through TSV cavity and TSV of 3D stacking was characterized and reported after assembly.

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来源期刊

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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