低温直接键合比较

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947416

F. Fournel, V. Larrey, C. Morales, C. Bridoux, H. Moriceau, F. Rieutord

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引用次数: 0

摘要

低温直接键合技术目前已广泛应用于许多领域。本文将介绍其中一些技术的机理。然后比较获得低温直接键合的不同方法各自的优缺点。

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Low temperature direct bonding comparison

Low temperature direct bonding technologies are now widely used for many applications. Mechanisms of some of these technics will be presented. The different way to obtain low temperature direct bonding will then be compared with their respective advantages and drawbacks.

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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