PECVD氮化硅氢释放的反应扩散模型

Prafullkrishna Dani, Leo Rizzi, J. Franz, J. Knoch
{"title":"PECVD氮化硅氢释放的反应扩散模型","authors":"Prafullkrishna Dani, Leo Rizzi, J. Franz, J. Knoch","doi":"10.1109/IITC/MAM57687.2023.10154702","DOIUrl":null,"url":null,"abstract":"In this work, release of hydrogen from PECVD silicon nitride films of different thicknesses was studied using thermal desorption spectroscopy. A reaction-diffusion model is presented to describe the hydrogen release phenomenon. Change in bonded and total concentration of hydrogen in the film after rapid thermal annealing was characterized using inert gas fusion analysis and Fourier transformed infrared spectroscopy. The model was validated against experimental results.","PeriodicalId":241835,"journal":{"name":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reaction-diffusion model for hydrogen release from PECVD silicon nitride\",\"authors\":\"Prafullkrishna Dani, Leo Rizzi, J. Franz, J. Knoch\",\"doi\":\"10.1109/IITC/MAM57687.2023.10154702\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, release of hydrogen from PECVD silicon nitride films of different thicknesses was studied using thermal desorption spectroscopy. A reaction-diffusion model is presented to describe the hydrogen release phenomenon. Change in bonded and total concentration of hydrogen in the film after rapid thermal annealing was characterized using inert gas fusion analysis and Fourier transformed infrared spectroscopy. The model was validated against experimental results.\",\"PeriodicalId\":241835,\"journal\":{\"name\":\"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC/MAM57687.2023.10154702\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC/MAM57687.2023.10154702","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文采用热解吸光谱法研究了不同厚度的PECVD氮化硅膜中氢气的释放。提出了一个反应扩散模型来描述氢释放现象。利用惰性气体熔合分析和傅里叶变换红外光谱对快速退火后膜中氢键和氢总浓度的变化进行了表征。模型与实验结果进行了对比验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reaction-diffusion model for hydrogen release from PECVD silicon nitride
In this work, release of hydrogen from PECVD silicon nitride films of different thicknesses was studied using thermal desorption spectroscopy. A reaction-diffusion model is presented to describe the hydrogen release phenomenon. Change in bonded and total concentration of hydrogen in the film after rapid thermal annealing was characterized using inert gas fusion analysis and Fourier transformed infrared spectroscopy. The model was validated against experimental results.
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