与应变CESL性能助推器相关的HfSiON MOSFET的行为和物理退化

Kidan Bae, M. Jin, H. Lim, Lira Hwang, Dongseok Shin, Junekyun Park, Jin-Chul Heo, Jongho Lee, Jinho Do, Ilchan Bae, Chul-Hee Jeon, Jongwoo Park
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引用次数: 2

摘要

详细研究了在应变SiN-CESL性能增强器上HfSiON MOSFET的HCI和BTI降解倾向。研究发现,HfO基n/p MOSFET器件的HCI和BTI寿命取决于氢气、初始Dit和等离子体充电,这与PECVD制备的CESL的应力类型有内在的关系。在拉伸CESL的情况下,n/p MOSFET器件远远超过HCI和BTI的可靠性目标。而在n/p MOSFET上压缩CESL会显著降低HCI和BTI寿命。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Behaviors and physical degradation of HfSiON MOSFET linked to strained CESL performance booster
The propensity of HCI and BTI degradation of HfSiON MOSFET on strained SiN-CESL performance booster is meticulously investigated. It is found that HCI and BTI lifetime of HfO based n/p MOSFET devices depend on hydrogen, initial Dit and plasma charging inherently related to the stress type of CESL fabricated with PECVD. In case for tensile CESL, n/p MOSFET devices far exceed reliability targets for both HCI and BTI. While compressive CESL on n/p MOSFET drastically depresses HCI and BTI lifetime.
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