累积模式薄膜SOI/NMOSFET的热载子效应

Binglong Zhang, T. Ma, L.K. Wang
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引用次数: 1

摘要

热载流子效应在增强模式薄膜SOI/NMOSFET器件中的研究已经相当广泛,但在积累模式器件中的类似研究仍然缺乏。本文将报导累积模式薄膜SOI/NMOSFET的热载子效应。讨论了前通道和后通道晶体管参数的变化。一个特别有趣的效应是,在热载子损坏后以反向模式测量时,漏源击穿电压增加。将提出一个基于热载子诱导的背界面陷阱导致空穴/电子复合率增加的模型来解释这种效应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hot-carrier effects in accumulation-mode thin-film SOI/NMOSFET's
Hot-carrier effects in enhancement-mode thin-film SOI/NMOSFET's have been studied quite extensively, but similar studies in accumulation-mode devices are still lacking. This paper will report hot-carrier effects in accumulation-mode thin-film SOI/NMOSFET's. Changes in both front- and back-channel transistor parameters are discussed. One particularly interesting effect is the increased drain-source breakdown voltage when measured in the reverse mode after hot-carrier damage. A model based on the increased hole/electron recombination rate due to hot-carrier induced back interface traps will be proposed to explain the effect.<>
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