寻找通用探头卡的解决方案

Proceedings International Test Conference 1997 Pub Date : 1997-11-01 DOI:10.1109/TEST.1997.639661

R. Bates

{"title":"寻找通用探头卡的解决方案","authors":"R. Bates","doi":"10.1109/TEST.1997.639661","DOIUrl":null,"url":null,"abstract":"Epoxy Ring, Cobra, and other new products are evaluated against the demand for high pin count, high frequency, high temperature, multi-DUT, long life, etc. There doesn't appear to be a single universal solution, but rather each technology provides a usable response to the growing wafer test requirements. However, the climate is right for creativity and innovation to meet the challenges of the future.","PeriodicalId":186340,"journal":{"name":"Proceedings International Test Conference 1997","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"The search for the universal probe card solution\",\"authors\":\"R. Bates\",\"doi\":\"10.1109/TEST.1997.639661\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Epoxy Ring, Cobra, and other new products are evaluated against the demand for high pin count, high frequency, high temperature, multi-DUT, long life, etc. There doesn't appear to be a single universal solution, but rather each technology provides a usable response to the growing wafer test requirements. However, the climate is right for creativity and innovation to meet the challenges of the future.\",\"PeriodicalId\":186340,\"journal\":{\"name\":\"Proceedings International Test Conference 1997\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Test Conference 1997\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1997.639661\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Test Conference 1997","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1997.639661","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 18

摘要

针对高引脚数、高频、高温、多dut、长寿命等需求，对Epoxy Ring、Cobra等新产品进行了评估。似乎没有单一的通用解决方案，但每种技术都提供了对不断增长的晶圆测试需求的可用响应。然而，创造和创新的气候正适合迎接未来的挑战。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

The search for the universal probe card solution

Epoxy Ring, Cobra, and other new products are evaluated against the demand for high pin count, high frequency, high temperature, multi-DUT, long life, etc. There doesn't appear to be a single universal solution, but rather each technology provides a usable response to the growing wafer test requirements. However, the climate is right for creativity and innovation to meet the challenges of the future.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings International Test Conference 1997

自引率

0.00%

发文量