{"title":"微波密封包装用埋地双键线","authors":"Sung-Jin Kim, Hai-Young Lee","doi":"10.1109/EPEP.1997.634072","DOIUrl":null,"url":null,"abstract":"Double bondwires buried in a dielectric material is proposed for high frequency hermetic packages and characterized experimentally and theoretically up to 30 GHz. These buried bondwires made it possible to achieve 15 dB improvement of return loss at 20 GHz compared to conventional bondwires.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Buried double bondwires for microwave hermetic packages\",\"authors\":\"Sung-Jin Kim, Hai-Young Lee\",\"doi\":\"10.1109/EPEP.1997.634072\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Double bondwires buried in a dielectric material is proposed for high frequency hermetic packages and characterized experimentally and theoretically up to 30 GHz. These buried bondwires made it possible to achieve 15 dB improvement of return loss at 20 GHz compared to conventional bondwires.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634072\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634072","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Buried double bondwires for microwave hermetic packages
Double bondwires buried in a dielectric material is proposed for high frequency hermetic packages and characterized experimentally and theoretically up to 30 GHz. These buried bondwires made it possible to achieve 15 dB improvement of return loss at 20 GHz compared to conventional bondwires.
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