电子塑料封装的声学评价

30th Annual Proceedings Reliability Physics 1992 Pub Date : 1992-03-01 DOI:10.1109/RELPHY.1992.187662

J. Siettmann, R. Dias, K. Fiebelkorn

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引用次数: 12

摘要

介绍了一种c模扫描声显微镜(CSAM)图像采集技术。考虑了声反射波分析在CSAM图像采集中的作用。说明了模具复合厚度和换能器的选择对塑料封装引线框架特征分辨率的影响。提出了声反射波分析的应用前景。

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Acoustic evaluation of electronic plastic packages

Describe a technique of C-mode scanning acoustic microscope (CSAM) image acquisition. The role acoustic reflected wave analysis plays in the acquisition of CSAM images is considered. The effect that mold compound thickness and transducer choice have on the resolution of leadframe features in plastic packages is illustrated. Potential applications of acoustic reflected wave analysis are presented.<>

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30th Annual Proceedings Reliability Physics 1992

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