集成无源元件的硅对硅mcm

R. Frye, K. Tai, M. Lau, A.W. Lin
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引用次数: 36

摘要

作者评估了一个原型硅对硅多芯片模块的潜在用途在成本驱动的应用。集成的无源元件,电阻和电容,在模块衬底是一个显着的优势,在许多这类应用。构建了一个集成线性、双极和数字CMOS电路的模块。讨论了该模块的独特特性,以及由此产生的无源元件的特性和性能限制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon-on-silicon MCMs with integrated passive components
The authors evaluate a prototype silicon-on-silicon multichip module for potential use in cost-driven applications. The incorporation of integrated passive components, resistors and capacitors, in the module substrate is a significant advantage in many of these kinds of applications. A module has been built that incorporates both linear and bipolar and digital CMOS circuits. The unique features of the module are discussed, as well as the properties and performance limits of the resulting passive components.<>
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