H. Li, Leong Yew Wing, Hwang Gilho, Chong Kok Piau, N. Jaafar, S. Chungpaiboonpatana
{"title":"隔离微碰撞工艺的开发和改进","authors":"H. Li, Leong Yew Wing, Hwang Gilho, Chong Kok Piau, N. Jaafar, S. Chungpaiboonpatana","doi":"10.1109/EPTC.2016.7861581","DOIUrl":null,"url":null,"abstract":"Low density micro-bumps were required for assembly of different technologies connection within 3D and 2.5D packaging. 6μm and 8um bump heights after reflow are required for 15μm and 25μm (Cu/SnAg) diameter micro-bump, respectively. At same time, the pattern density of 15um and 25μm diameter micro-bump are 0.045% and 0.127%. This paper reported the process challenges, evaluation and development. The average test yields after process development and optimization for 25μm and 15μm micro-bump are 94.5% and 47.5%, respectively.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Isolate micro-bump process development and improvement\",\"authors\":\"H. Li, Leong Yew Wing, Hwang Gilho, Chong Kok Piau, N. Jaafar, S. Chungpaiboonpatana\",\"doi\":\"10.1109/EPTC.2016.7861581\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Low density micro-bumps were required for assembly of different technologies connection within 3D and 2.5D packaging. 6μm and 8um bump heights after reflow are required for 15μm and 25μm (Cu/SnAg) diameter micro-bump, respectively. At same time, the pattern density of 15um and 25μm diameter micro-bump are 0.045% and 0.127%. This paper reported the process challenges, evaluation and development. The average test yields after process development and optimization for 25μm and 15μm micro-bump are 94.5% and 47.5%, respectively.\",\"PeriodicalId\":136525,\"journal\":{\"name\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2016.7861581\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861581","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Isolate micro-bump process development and improvement
Low density micro-bumps were required for assembly of different technologies connection within 3D and 2.5D packaging. 6μm and 8um bump heights after reflow are required for 15μm and 25μm (Cu/SnAg) diameter micro-bump, respectively. At same time, the pattern density of 15um and 25μm diameter micro-bump are 0.045% and 0.127%. This paper reported the process challenges, evaluation and development. The average test yields after process development and optimization for 25μm and 15μm micro-bump are 94.5% and 47.5%, respectively.
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