{"title":"高可靠性PKG铜岩心凹凸形成新概念的力学性能研究","authors":"J. Son, Haksan Jeong, S.G. Lee, Y. Lee, S. Jung","doi":"10.1109/EPTC47984.2019.9026666","DOIUrl":null,"url":null,"abstract":"Nowadays, 2D structure of PKG needs to change to 2.5D or 3D structure for high performance of PKG. The standoff property was required to prevent the Si chip damage and electrical short when solder joint is located between substrate and interposer. So, CCSB (Cu Core Solder Ball) is the most popular candidate of interconnection material for 2.5D PKG. However, controlling of plated solder composition has limitation due to difficult deposition over 3 elements by electroplating system. So, SAC305 composition was plated for CCSB product. In this paper, we studied Cu bump formation of new concept. At first, Cu bump was formed with combination with 1st reflowed solder bump and specially controlled Cu ball which is the surface treatment layer to get good wetting property of liquid solder by additional reflow. The applied solder is the Sn-2.5Ag-0.8Cu-0.05Ni-1Bi (MXT02) for high reliability. New concept Cu bump showed higher joint strength than general CCSB product. Therefore, new concept of Cu core ball will show higher reliability, easy application and more fine pitch then general CCSB product.","PeriodicalId":244618,"journal":{"name":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mechanical property of new concept about Cu core bump formation For high reliability PKG\",\"authors\":\"J. Son, Haksan Jeong, S.G. Lee, Y. Lee, S. Jung\",\"doi\":\"10.1109/EPTC47984.2019.9026666\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nowadays, 2D structure of PKG needs to change to 2.5D or 3D structure for high performance of PKG. The standoff property was required to prevent the Si chip damage and electrical short when solder joint is located between substrate and interposer. So, CCSB (Cu Core Solder Ball) is the most popular candidate of interconnection material for 2.5D PKG. However, controlling of plated solder composition has limitation due to difficult deposition over 3 elements by electroplating system. So, SAC305 composition was plated for CCSB product. In this paper, we studied Cu bump formation of new concept. At first, Cu bump was formed with combination with 1st reflowed solder bump and specially controlled Cu ball which is the surface treatment layer to get good wetting property of liquid solder by additional reflow. The applied solder is the Sn-2.5Ag-0.8Cu-0.05Ni-1Bi (MXT02) for high reliability. New concept Cu bump showed higher joint strength than general CCSB product. Therefore, new concept of Cu core ball will show higher reliability, easy application and more fine pitch then general CCSB product.\",\"PeriodicalId\":244618,\"journal\":{\"name\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"95 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC47984.2019.9026666\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC47984.2019.9026666","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
目前，为了提高PKG的性能，PKG的二维结构需要转变为2.5D或3D结构，要求其具有防区隔性，以防止在衬底和中间层之间的焊点损坏硅片和电短路。因此，CCSB (Cu Core Solder Ball)是最受欢迎的2.5D PKG互连材料候选材料，然而，由于电镀系统难以沉积超过3个元素，电镀焊料成分的控制受到限制。因此，在CCSB产品中镀上SAC305组合物。本文研究了铜碰撞形成的新概念。首先，将第一次回流焊包与特殊控制的Cu球(表面处理层)结合形成Cu凸包，通过附加回流获得良好的液态焊料润湿性能。焊料为Sn-2.5Ag-0.8Cu-0.05Ni-1Bi (MXT02)，可靠性高。新概念铜凸块比一般CCSB产品具有更高的接头强度。因此，与一般CCSB产品相比，新概念的铜芯球具有更高的可靠性、易于使用和更精细的螺距。
Mechanical property of new concept about Cu core bump formation For high reliability PKG
Nowadays, 2D structure of PKG needs to change to 2.5D or 3D structure for high performance of PKG. The standoff property was required to prevent the Si chip damage and electrical short when solder joint is located between substrate and interposer. So, CCSB (Cu Core Solder Ball) is the most popular candidate of interconnection material for 2.5D PKG. However, controlling of plated solder composition has limitation due to difficult deposition over 3 elements by electroplating system. So, SAC305 composition was plated for CCSB product. In this paper, we studied Cu bump formation of new concept. At first, Cu bump was formed with combination with 1st reflowed solder bump and specially controlled Cu ball which is the surface treatment layer to get good wetting property of liquid solder by additional reflow. The applied solder is the Sn-2.5Ag-0.8Cu-0.05Ni-1Bi (MXT02) for high reliability. New concept Cu bump showed higher joint strength than general CCSB product. Therefore, new concept of Cu core ball will show higher reliability, easy application and more fine pitch then general CCSB product.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
