PCB设计和材料对芯片焊点可靠性的影响

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464569

M. Berthou, P. Retailleau, H. Frémont, A. Guédon-Gracia, C. Jéphos-Davennel

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引用次数: 1

摘要

本文描述了三种基板上的芯片焊点可靠性:一种是SMI(铝基板)，另一种是FR4中两种不同的板。几种芯片尺寸和类型(电阻器，电容器)组装在这些板上。采用加速热循环(ATC) -55/+125°C来评估片状焊点的寿命。得到的不同结果表明，根据衬底类型的不同，在失效时间(TTF)上有重要的分散。文献资料证实了这种分散。为了理解这种差异，采用有限元建模(FEM)分析来评估PCB设计和材料对焊料芯片组件可靠性的影响。模拟可以确定哪些参数影响最大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Influence of PCB design and materials on chip solder joint reliability

This paper describes chip solder joint reliability on three substrate types: one board SMI (aluminium substrate) and two different boards in FR4. Several chip sizes and types (resistor, capacitor) were assembled on these boards. Accelerated Thermal cycles (ATC) -55/+125°C were applied to evaluate the lifetime of chip solder joints. The different results obtained showed an important dispersion in Time To Failure (TTF) according to the substrate type. Literature data confirm this dispersion. To understand this discrepancy Finite Element Modelling (FEM) analyses were used to evaluate the influence of PCB design and materials on solder chip component reliability. The simulations permit to identify which parameters are the most influent.

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2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

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